SAILIホイール_会社製品案内（SAILI）

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Diamond dicing blade for silicon wafer, ultra thin and precision, more rigidity, accuracy, prevent the operation from slant and vibration. Diamond/CBN blades for the precision cutting of wafer, magnetic head, IC, LSI, optical fiber, etc. resin, metal and electroformed bonds. Metal bonded diamond wheels, ultra thin and precision, group application, excellent rigidity and accuracy, fit for deep and strong cutting. Vitrified diamond wheel for the thinning and finishing of silicon wafer and other compound semiconductor wafers. Quality stability, Free Cutting. Hybrid (resin and metal) diamond and CBN wheel, new technology, high stock removal, high heat resistance, excellent profile retention, fit on CNC grinders. Electroplated diamond/CBN wheels for jg grinding, groove finishing, diamond polishing and other wheels with complicated profile for the application of metal and nonmetal.